Method for improving circuit layout for manufacturability

ABSTRACT

A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.

PRIORITY

The present application is a continuation application of U.S.application Ser. No. 15/411,613 filed on Jan. 20, 2017, which claims thebenefit of U.S. Prov. App. No. 62/402,790, entitled “Method forImproving Circuit Layout for Manufacturability,” filed Sep. 30, 2016,each of which is hereby incorporated by reference in its entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. This scaling downprocess generally provides benefits by increasing production efficiencyand lowering associated costs, but it has also increased the complexityof processing and manufacturing ICs.

For example, a mandrel-cut double patterning technique is generally usedwhen fabricating IC devices with high density, such as devices withfin-like field effect transistors (FinFETs). Mandrel-cut doublepatterning technique typically uses two patterns. The first one definesa mandrel pattern with relatively uniform pattern pitch and sizes, andthe second one defines a cut pattern. The cut pattern removes unwantedportions of the mandrel pattern, a derivative, or both. Using suchtechnique typically improves photolithographic process window. However,current mandrel-cut double patterning techniques are not totallysatisfactory. For instance, some cut pattern designs have unnecessarilycomplicated pattern layout and/or narrow end-to-end spaces betweenpatterns, making it difficult for mask and wafer fabrication.

Accordingly, improvements in cut pattern designs are desired.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a simplified block diagram of an embodiment of an integratedcircuit (IC) manufacturing system and an associated IC manufacturingflow.

FIGS. 2A and 2B illustrate two different layout patterns and theircorresponding mask patterns, according to embodiments of the presentdisclosure.

FIGS. 3A, 3B, 3C, 3D, and 3E illustrate an IC layout during variousstages of a layout modification process, according to embodiments of thepresent disclosure.

FIGS. 4A, 4B, 4C, and 4D illustrate an IC layout during various stagesof another layout modification process, according to embodiments of thepresent disclosure.

FIGS. 5A and 5B illustrate an IC layout before and after a layoutmodification process, according to embodiments of the presentdisclosure.

FIG. 6A illustrates an IC layout, according to embodiments of thepresent disclosure.

FIG. 6B illustrates an example produced by a layout modification processapplied to FIG. 6A.

FIG. 6C illustrates an example rejected by a layout modification processapplied to FIG. 6A.

FIGS. 7A, 7B, and 7C illustrate another IC layout before and after alayout modification process, according to embodiments of the presentdisclosure.

FIG. 8A illustrates an IC layout, according to embodiments of thepresent disclosure.

FIGS. 8B, 8C, and 8D illustrate examples that are rejected by a layoutmodification process applied to FIG. 8A.

FIG. 9 is an example of a mask house tool used by the mask house of FIG.1, according to various aspects of the present disclosure.

FIG. 10 is a flow chart of a method of designing or modifying cutpatterns according to one or more embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure is generally related to methods for manufacturingintegrated circuits (IC), and more particularly related to applyingmandrel-cut double patterning techniques for IC fabrication.

FIG. 1 is a simplified block diagram of an embodiment of an integratedcircuit (IC) manufacturing system 100 and an IC manufacturing flowassociated therewith, which may benefit from various aspects of thepresent disclosure. The IC manufacturing system 100 includes a pluralityof entities, such as a design house 120, a mask house 130, and an ICmanufacturer (or fab) 150, that interact with one another in the design,development, and manufacturing cycles and/or services related tomanufacturing an integrated circuit (IC) device 160. The plurality ofentities are connected by a communications network, which may be asingle network or a variety of different networks, such as an intranetand the Internet, and may include wired and/or wireless communicationchannels. Each entity may interact with other entities and may provideservices to and/or receive services from the other entities. One or moreof the design house 120, mask house 130, and fab 150 may be owned by asingle company, and may even coexist in a common facility and use commonresources. In a brief overview, the design house 120 produces an ICdesign layout 122 stored in data file 124, the mask house 130 producesone or more masks 146 using the data file 124, and the fab 150manufactures one or more wafers 152 using the masks 146, therebyproducing the IC devices 160. A more detailed description of each entityis presented below.

The design house (or design team) 120 generates an IC design layout 122,which includes various geometrical patterns designed for the IC device160. The geometrical patterns correspond to patterns of metal, oxide, orsemiconductor layers that make up the various components of the ICdevice 160. For example, a portion of the IC design layout 122 mayinclude IC features such as active regions, gate electrodes, source anddrain features, local (or level 0) interconnect lines, metal lines orvias of an interlayer interconnect, and openings for bonding pads to beformed in or on a semiconductor substrate (such as a silicon wafer). Thedesign house 120 implements a proper design procedure to form the ICdesign layout 122. The design procedure may include logic design,physical design, and/or place and route. The IC design layout 122 ispresented in one or more data files 124 having information of thegeometrical patterns. For example, the data files 124 may be in GDSIIfile format, DFII file format, or other suitable file formats.

The mask house 130 uses the IC layout 122 to manufacture one or moremasks 146 to be used for fabricating the various layers of the IC device160. The mask house 130 performs mask data preparation 132, where the IClayout 122 is translated into a form that can be physically written by amask writer, and mask fabrication 144, where the data prepared by themask data preparation 132 is modified to comply with a particular maskwriter and/or mask manufacturer and is then fabricated. In the presentembodiment, mask data preparation 132 and mask fabrication 144 areillustrated as separate elements. However, mask data preparation 132 andmask fabrication 144 can be collectively referred to as mask datapreparation.

In today's advanced manufacturing processes, the IC layout 122 generallyneeds to comply with a set of manufacturing rules in order to befabricated properly downstream, including by the mask fabrication 144.Merely as an example for FinFET processes, fin active regions aredesigned to be rectangular features and are oriented lengthwise in onedirection, and gate electrodes are designed to be rectangular features(top view) and are oriented lengthwise perpendicular to the fin activeregions. Further, local interconnect lines are frequently used forinterconnecting source and drain regions among transistors and aredisposed at the same level of stack as the gate electrodes. In otherwords, both the local interconnect lines and the gate electrodes aredisposed below inter-layer interconnects. For the purposes of enlargingprocess window, the local interconnect lines are fabricated withmandrel-cut patterning techniques in the present disclosure. The mandrelpatterns may be designed as parallel rectangular pieces spaced with acertain pitch. The cut patterns may be designed as rectangular piecesoriented perpendicular to the mandrel patterns. Further, the cut patternmay be split into two or more subsets with each subset fabricated into aseparate mask. In the present embodiment, the mask data preparation 132includes a mandrel-cut pattern preparation module 138, which checks themandrel and cut patterns in the IC layout 122 and modifies the cutpatterns to improve the layout's manufacturability. The mask datapreparation 132 may include additional modules, such as opticalproximity correction (OPC), mask rule checker, lithography processchecker, and other resolution enhancement techniques (RET), which arenot shown in FIG.1.

FIG. 2A illustrates an exemplary IC layout 200 with various rectangularlayout patterns 201. The IC layout 200 is an embodiment of the IC designlayout 122 (FIG. 1). FIG. 2A further illustrates different outlines of apattern 201, including an original layout outline 202, an outline 204 asmodified by OPC, and a simulated contour 206. The original layoutoutline 202 is produced by the design house 120. The outline 204 isproduced by an OPC engine (not shown) in the mask data preparation 132and closely represents the corresponding pattern on the mask 146. Thesimulated contour 206 is produced by a simulator (not shown) in the maskhouse 130 based on the outline 204 and the manufacturing processesimplemented by the fab 150. The simulated contour 206 closely representsthe final pattern formed on the wafer 152. As illustrated, the outline(and shape) of the pattern 201 changes considerably throughout the maskand wafer manufacturing processes. FIG. 2A further illustrates a gap (orspacing) 208 between adjacent ends of the patterns 201 along the Xdirection. The gap 208 may be narrowed during the above manufacturingprocesses due to the changes of shape in the patterns 201. This mightlead to insufficient spacing between patterns, presenting challenges toboth mask fabrication and wafer fabrication. For example, insufficientspacing between patterns may cause shorting of patterns. In anembodiment, the patterns 201 are cut patterns used for cutting mandrelpatterns oriented perpendicular thereto. Shorting of the cut patterns201 means some mandrel pattern(s) might be mistakenly cut (or kept).

One approach to this problem is to split the patterns 201 into two ormore subsets. For example, one subset may include every other patterns201 along the X direction and the other subset may include the remainingpatterns 201. Each subset is fabricated into a separate mask 146. Inembodiments, this approach enlarges the spacing between adjacentpatterns 201 in any of the masks 146, thereby enlarging themanufacturing process window.

FIG. 2B illustrates another approach to the above problem. Referring toFIG. 2B, an IC layout 220 includes various patterns 221 that aredesigned as square or near-square shapes. The IC layout 220 is anembodiment of the IC design layout 122 (FIG. 1). Various outlines of apattern 221 include an original outline 222 produced by the design house120, an OPC-modified outline 224, and a simulated contour 226. Asillustrated in FIG. 2B, the various outlines of the patterns 221 closelymatch one another. In other words, the shape of the patterns 221 remainsubstantially the same throughout the mask and wafer manufacturingprocesses. Consequently, gaps 228 between adjacent patterns 221 alongthe X direction remain substantially the same throughout the mask andwafer manufacturing processes. In embodiments, this approach of havingsmall and/or square patterns advantageously reduces the number of masks146 and reduces the number of photolithography processes performed bythe fab 150, thereby reducing manufacturing costs.

In some embodiments, the module 138 uses one or both of the aboveapproaches when creating or modifying cut patterns in order to improvemanufacturability of the layout. FIGS. 3A-3E illustrate an IC layout 300undergoing various stages of the layout modification by the module 138,constructed according to an embodiment of the present disclosure. FIGS.4A-4D illustrate an IC layout 400 undergoing various stages of layoutmodification by the module 138, constructed according to anotherembodiment of the present disclosure. FIGS. 5A-5B illustrate an IClayout 500 before and after layout modification by the module 138,constructed according to an embodiment of the present disclosure. FIGS.7A-7C illustrate an IC layout 700 before and after layout modificationby the module 138, constructed according to another embodiment of thepresent disclosure. The IC layouts 300, 400, 500, and 700 areembodiments of the IC design layout 122 (FIG. 1). FIGS. 6A-6C and 8A-8Dillustrate some scenarios that may be accepted or rejected by the module138. Various aspects of the mandrel-cut pattern preparation module 138are discussed below in conjunctions with FIGS. 3A-8D.

Referring to FIG. 3A, the module 138 receives the IC layout 300. The IClayout 300 includes a first region 302 interposed between two secondregions 304. In an embodiment, the first region 302 is for placing androuting power rails, such as positive power supply lines, negative powersupply lines, and/or ground lines. To further this embodiment, thesecond regions 304 are for placing standard cells, such as AND, OR, XOR,NAND, and inverters. The first region 302 and the second regions 304 areoriented lengthwise along the X direction. The IC layout 300 may includeother regions (not shown) such as I/O cell regions. Further, the regions302 and 304 may be used for other types of circuit feature besides powerrail routing and standard cell placement.

The layout 300 includes multiple layers for forming various circuitfeatures. In the present embodiment, the layout 300 includes a firstlayer having features 306 oriented lengthwise along the Y directionperpendicular to the X direction. The features 306 traverse the firstregion 302 and extend into both the second regions 304 in thisembodiment. In some embodiments, some of the features 306 may extendinto one of the second regions 304, but not both. Further in the presentembodiment, the features 306 have about uniform width W_(m) andseparated from each other by about uniform pitch P_(m). Having uniformsize and pitch in the features 306 may help improve lithography processwindow. The layout 300 further includes a feature 308 which is orientedlengthwise along the Y direction and is not connected to the standardcells in the regions 304. In an embodiment, the feature 308 is a dummyfeature. In another embodiment, the feature 308 is a long interconnect.The layout 300 further includes vias (or via features) 310 in the firstregion 302. Each via 310 lands on one of the features 306 and connectsthe respective feature 306 to higher level interconnects (not shown).

In the present embodiment, the features 306 are mandrel patterns thatcorrespond to local interconnect lines. In a further embodiment, each ofthe local interconnect lines is connected to standard cells in one ofthe second regions 304, but not both. To achieve this, the layout 300further includes one or more cut layers having cut patterns that cut thefeatures 306 into two or more segments. In the embodiment shown, thelayout 300 includes two cut layers. The first cut layer includes cutpatterns A in the first region 302 and cut patterns 312 in the secondregions 304. The second cut layer includes cut patterns B in the firstregion 302 and cut patterns 314 in the second regions 304. Separatingthe cut patterns A, B, 312, and 314 into two cut layers may be performedby the module 138, by another module (not shown) in the mask datapreparation 132, or by the design house 120. In embodiments, thefeatures 306 may be mandrel patterns for other circuit features insteadof local interconnect lines. For example, the features 306 may bemandrel patterns for fin structures.

In the present embodiment, each of the cut patterns 312 and 314 is arectangular piece oriented lengthwise in the X direction. In contrast,the cut patterns A and B have relatively more complicated layout thanthe cut patterns 312 and 314 because the vias 310 cannot be cut by thecut patterns A and B. The complicated layout presents a challenge tomask and/or wafer manufacturing.

FIG. 3A illustrates a gap 318 between two adjacent cut patterns A, oneof which is an elongated piece. FIG. 3A further illustrates a gap 328between two adjacent cut patterns B, both of which are elongated pieces.The gaps 318 and 328 each have a size about P_(m) along the X direction.As discussed with respect to FIG. 2A, the gaps 318 and 328 may presentdifficulty during mask and wafer manufacturing. The module 138 modifiesthe layout 300 to improve process window, for example, by replacing theelongated cut patterns A and B with smaller or square cut patterns asillustrated in FIGS. 3B-3E.

Referring to FIG. 3B, the module 138 replaces the cut patterns A and Bwith blocks in the first region 302. For ease of understanding, theblocks in the first cut layer are labeled with “A,” and the blocks inthe second cut layer are labeled with “B.” The blocks are also cutpatterns (or modified cut patterns) for the features 306. The width ofeach block A or B is about equal to P_(m), and each of the blocks A andB cuts one and only one of the features 306. Further, the blocks A and Bare arranged alternately over the features 306, as illustrated in FIG.3B. Still further, at this step, the module 138 adds a block onto thefeature 308. This block will be removed in a further step.

Next, the module 138 checks if any of the blocks A and B overlap thevias 310 in the first region 302. If a block overlaps a via 310 in thefirst region 302, then the module 138 shifts the respective block withinthe first region 302 such that it does not overlap the via. Taking FIG.3B as an example, the third block B from the left overlaps with a via310. The module 138 moves it down so that this block B does not overlapwith the via 310, as shown in FIG. 3D. In the embodiment shown in FIG.3D, the block B is moved to be aligned with the blocks A from a topview. Since the blocks A and B are at different cut layers, spacingbetween them is not a concern for mask and wafer fabrication.

In another embodiment, the shifting operation is accomplished by twosteps: removing the respective block, and adding another block in thesame cut layer at a different position. Taking FIG. 3B as an example,the module 138 may remove the third block B from the left, resulting inthe layout 300 as shown in FIG. 3C. Then the module 138 adds a new blockB to cut the same feature 306 at a position aligned with the blocks Afrom a top view, resulting in the layout 300 as shown in FIG. 3D. Themodule 318 checks to make sure that the new block B does not overlapwith a via 310.

The module 138 also checks if any of the blocks A and B cut a featurethat is not supposed to be cut, as shown in FIG. 3A. For example, therightmost block B in FIG. 3B cuts the feature 308 which is not cut inFIG. 3A. Once this block is found, the module 138 removes it from thelayout, resulting in the layout 300 such as shown in FIG. 3E. Thisensures the modified layout (such as in FIG. 3E) matches the layoutbefore the modification process (such as in FIG. 3A).

Referring to FIG. 3E, after the module 138 finishes the stepsillustrated in FIGS. 3B-3E and discussed above, a modified layout 300 isobtained. Comparing the layout 300 in FIGS. 3A and 3E, the followingobservation is made. First, the total spacing between adjacent blocks Ain the modified layout (which is about 3*P_(m) in FIG. 3E) is greaterthan the total spacing between adjacent patterns A in thepre-modification layout (which is about 2*P_(m) in FIG. 3A). Second, thetotal length of the blocks A in the modified layout (which is about4*P_(m) in FIG. 3E) is smaller than the total length of the patterns Ain the pre-modification layout (which is about 5*P_(m) in FIG. 3A).Third, the total spacing between adjacent blocks B in the modifiedlayout (which is about 2*P_(m) in FIG. 3E) is greater than the totalspacing between adjacent patterns B in the pre-modification layout(which is about 1*P_(m) in FIG. 3A). Fourth, the total length of theblocks B in the modified layout (which is about 3*P_(m) in FIG. 3E) issmaller than the total length of the patterns B in the pre-modificationlayout (which is about 4*P_(m) in FIG. 3A).

Still comparing the layouts between FIGS. 3A and 3E, even though theminimum spacing in the first cut layer is the same between the twolayouts, the modified layout in FIG. 3E is more manufacturer-friendlybecause the blocks A are shorter in length in FIG. 3E than the patternsA in FIG. 3A. Similarly, even though the minimum spacing in the secondcut layer is the same between the two layouts, the modified layout inFIG. 3E is more manufacturer-friendly. The above first through fourthobservations represent improvements in the modified layout over thepre-modification layout in terms of mask and/or wafer manufacturability.In various embodiments, the module 138 modifies the layout 122 toachieve one or more of the above first through fourth observations.

In some embodiments, the module 138 may employ two or more cut layers.While FIGS. 3B-3E represents an embodiment with two cut layers, FIGS.4A-4D represents an embodiment with three cut layers. Person havingordinary skill in the art may derive other embodiments of the module 138based on the teachings of FIGS. 3B-3E and FIGS. 4A-4D. The processembodied in FIGS. 4A-4D is briefly discussed below.

Referring to FIG. 4A, the module 138 replaces the cut patternsoriginally placed in the region 302 with blocks A, B, C in three cutlayers, first, second, and third cut layers respectively. Each of theblocks A, B, C has a length about P_(m). The blocks A, B, C are placedalternately on the features 306 and without regard to the via features310 and the continuous feature 308 at this step.

Next, the module 138 checks if any of the blocks A, B, and C overlapswith a via 310. If such a block is found, the module 138 removes it. Forexample, the first block C and the third block B from left in FIG. 4Aare removed at this step, resulting the layout 400 as shown in FIG. 4B.

Referring to FIG. 4C, the module 138 adds a block B (the third block Bfrom the left) onto a feature 306 which needs to be cut based onpre-modification layout (not shown). This effectively shifts the third Bblock on this feature 306 from a position overlapping with a via 310(FIG. 4A) to another position not overlapping with the via 310 (FIG.4C).

The module 138 also checks if any of the blocks A, B, and C cut afeature that is not cut in the pre-modification layout. For example, therightmost block A in FIG. 4C cuts the feature 308 which is not supposedto be cut. Once this block is found, the module 138 removes it from thelayout, resulting in the layout 400 as shown in FIG. 4D. This ensuresthe modified layout matches the layout before the modification process.

In embodiments, the module 138 may employ various other techniques toachieve the above first through fourth observations discussed withrespect to FIG. 3E. In an embodiment, the module 138 does not replacethe original cut patterns with cut blocks as shown in FIGS. 3A-4D.Instead, the module 138 identifies critical spacing between adjacent cutpatterns (e.g. spacing less than 2*P_(m)) and checks if any of themandrel features adjacent the critical spacing is overlapped by morethan one cut patterns of different cut layers. If such mandrel featureis found, the module 138 reduces the length of one of the cut patternssuch that it no longer cuts this mandrel feature. This effectivelyreduces the total length of the cut patterns in the respective cutlayer, as well as increases the spacing of the cut patterns in therespective cut layer. FIGS. 5A-5B and FIGS. 7A-7C illustrate twoexamples where the module 138 may implement such technique.

Referring to FIG. 5A, the layout 500 includes various features similarto those described with respect to the layout 300 (FIG. 3A). The layout500 further includes some features 307 having an end in the first region302 and extending into one of the two second regions 304 but not both.In the present embodiment, the modification of cut patterns on suchfeatures 307 is handled differently than the modification of cut patternon features 306.

In an embodiment, the module 138 identifies critical spacing in thelayout 500, such as spacing 318 in the first cut layer, and spacing 328in the second cut layer. Each of the spacing 318 and 328 has a widthabout equal to the pitch P_(m) of the mandrel features 307 and 306. Therespective cut patterns adjacent the spacing 318 and 328 are longpatterns. As discussed with respect to FIG. 2A, such layout presentsdifficulty for mask and wafer fabrication.

The module 138 also identifies two features 307 and 306 that areadjacent the spacing 318 and 328 respectively, and are cut by both cutpatterns A and B. This is illustrated in FIG. 5A by the dotted boxes 352and 354, each having a width about P_(m) along the X direction. Becausethe mandrel feature is cut by two cut patterns, one of the cut patternsmay be removed. The module 138 decides which cut pattern is removed, asdiscussed below.

With respect to the box 354, reducing the length of the cut pattern B inthe box 354 increases the width of the spacing 328, while reducing thelength of the cut pattern A in the box 354 does not increase the widthof either spacing 318 or spacing 328. Therefore, the portion of the cutpattern B in the box 354 is removed, and the cut pattern A in the box354 is kept.

With respect to the box 352, the same analysis is performed. The portionof the cut pattern A in the box 352 is removed, and the cut pattern B inthe box 352 is kept. The resultant layout 500 is shown in FIG. 5B, whereboth the spacing 318 and 328 are enlarged compared with FIG. 5A. Themodule 138 may increase other critical spacing using the same method.

By performing the above operations, at least one of the followingconditions is met: (1) the total spacing between adjacent patterns A inthe modified layout is greater than the total spacing between adjacentpatterns A in the pre-modification layout; (2) the total length of thepatterns A in the modified layout is smaller than the total length ofthe patterns A in the pre-modification layout; (3) the total spacingbetween adjacent patterns B in the modified layout is greater than thetotal spacing between adjacent patterns B in the pre-modificationlayout; and (4) the total length of the patterns B in the modifiedlayout is smaller than the total length of the patterns B in thepre-modification layout.

In the present embodiment, since the box 352 relates to the feature 307(having an end in the region 302), the module 138 performs a furtheranalysis to validate the above cut pattern removal decision, which isillustrated in FIG. 6A-6C. Referring to FIG. 6A, a layout 600 includes afeature 307 having an end being cut by two cut patterns 502 and 504.FIG. 6B illustrates a modified layout where the cut pattern 504 isremoved. The end of the feature 307 is sufficiently covered by the cutpattern 502 with a margin 506 within the cut pattern that is greaterthan or equal to a critical dimension CD. Therefore, the modified layout600 in FIG. 6B is deemed acceptable by the module 138. FIG. 6Cillustrates a modified layout where the cut pattern 502 is removed. Theend of the feature 307 is insufficiently covered by the cut pattern 504with a margin 508 within the cut pattern 504 that is less than thecritical dimension CD. The insufficient margin might lead to a scenariowhere the end of the feature 307 is not properly cut. Therefore, themodified layout 600 in FIG. 6C is rejected by the module 138. The sameacceptance (FIG. 6B) and rejection (FIG. 6C) would be made if the cutpattern 504 does not cover the end of the feature 307 while the cutpattern 502 covers the end of the feature 307. In the example shown inFIGS. 5A and 5B, the cut pattern removal in the box 352 is similar tothe scenario illustrated in FIG. 6B, and is therefore acceptable. On theother hand, if the module 138 finds that the cut pattern removal isunacceptable, it may undo the changes and seek other options to increasethe process window.

FIGS. 7A, 7B, and 7C illustrate another example where the module 138modifies a layout by identifying critical spacing, identifying portionsof cut patterns that are removable, and partially removing the cutpatterns accordingly. FIGS. 7A, 7B, and 7C are briefly discussed below.

Referring to FIG. 7A, the module 138 receives the layout 700 with firstregions 302, second regions 304, features 306, cut patterns A in a firstcut layer, and cut patterns B in a second cut layer. The module 138identifies critical spacing, such as spacing 318 in the first cut layer,and spacing 328 in the second layer (FIG. 7A may or may not show allcritical spacing). Of particular interest is the bottom-left criticalspacing 328 where the cut patterns B can be extended to eliminate thecritical spacing 328. In the present embodiment, the module 138 extendsthe cut patterns B to eliminate this critical spacing 328. The resultantlayout 700 is shown in FIG. 7B. It is noted that other critical spacingmay be eliminated by this method as well.

Next, the module 138 identifies portions of the cut patterns A and Bthat are removable, as illustrated by the dotted boxes 371, 372, 373,374, 375, 376, 377, 378, and 379. Each of the boxes has a width aboutP_(m) in this embodiment.

Next, the module 138 decides which of the removable portions of the cutpatterns A and B in the boxes 371-379 are to be removed, andsubsequently remove them. In the present embodiment, the portions of thecut patterns A in the boxes 372, 374, 375, 376, and 379 are removed; andthe portions of the cut patterns B in the boxes 371, 373, and 377 areremoved. The resultant layout 700 is shown in FIG. 7C. It is noted thateither pattern A or pattern B in the box 378 may also be removed inanother embodiment.

Next, the module 138 may perform the checking illustrated in FIGS.6A-6C.

Next, the module 138 may perform other checking to ensure that themodified layout matches the pre-modification layout in terms of circuitfunctionality. Some of the other checking are illustrated in FIGS.8A-8D. FIG. 8A illustrate a layout 800 (cut patterns only) prior tomodification by the module 138. FIGS. 8B-8D each illustrates a modifiedcut pattern layout that is rejected by the module 138. In FIG. 8B, a cutpattern 402 is placed in an area of the layout which is not supposed tobe cut. In FIG. 8C, all cut patterns in an area 404 are removed, leavingno cut pattern in the area 404. In FIG. 8D, a single cut pattern in anarea 406 is removed, leaving no cut pattern in the area 406.

Referring back to FIG. 1, after mask data preparation 132 modifies theIC layout 122, a mask 146 or a group of masks 146 are fabricated basedon the modified IC layout during mask fabrication 144. For example, anelectron-beam (e-beam) or a mechanism of multiple e-beams is used toform a pattern on a mask (photomask or reticle) based on the modified ICdesign layout. The mask 146 can be formed in various technologies. Inone embodiment, the mask 146 is formed using binary technology. Tofurther this embodiment, a mask pattern includes opaque regions andtransparent regions. A radiation beam, such as an ultraviolet (UV) beam,used to expose the image sensitive material layer (e.g., photoresist)coated on a wafer, is blocked by the opaque region and transmits throughthe transparent regions. In one example, a binary mask includes atransparent substrate (e.g., fused quartz) and an opaque material (e.g.,chromium) coated in the opaque regions of the mask. In another example,the mask 146 is formed using a phase shift technology. In the phaseshift mask (PSM), various features in the pattern formed on the mask areconfigured to have proper phase difference to enhance the resolution andimaging quality. In various examples, the phase shift mask can beattenuated PSM or alternating PSM as known in the art. In yet anotherexample, the mask 146 is formed to be a reflective mask. For example, areflective mask may include a low thermal expansion material (LTEM)layer, a reflective multilayer (ML) over the LTEM layer, an absorberlayer over the ML, and other layers. The ML is designed to reflect aradiation such as an extreme ultraviolet (EUV) light having a wavelengthof about 1-100 nm. The absorber layer is designed to have certain maskpatterns that determine how the radiation is reflected or absorbed. Inthe present embodiment, the mandrel and cut patterns prepared by themodule 132 are formed on the masks 146. Particularly, the mandrelpatterns, the modified cut patterns A, and the modified cut patterns Bmay be formed in separate masks. The masks 146 may include other layersin addition to the layers having the mandrel and cut patterns. Becausethe mandrel-cut pattern preparation module 138 produces layouts withenlarged process window for the mask fabrication, the quality of themasks 146 is improved.

The fab 150, such as a semiconductor foundry, uses the masks 146 tofabricate the IC device 160. The IC manufacturer 150 is an ICfabrication business that can include a myriad of manufacturingfacilities for the fabrication of a variety of different IC products.For example, there may be a first manufacturing facility for the frontend fabrication of IC products (i.e., front-end-of-line (FEOL)fabrication), while a second manufacturing facility may provide the backend fabrication for the interconnection and packaging of the IC products(i.e., back-end-of-line (BEOL) fabrication), and a third manufacturingfacility may provide other services for the foundry business. In thepresent embodiment, a semiconductor wafer 152 is fabricated using themasks 146 to form the IC device 160. The semiconductor wafer 152includes a silicon substrate or other proper substrate having materiallayers formed thereon. Other proper substrate materials include anothersuitable elementary semiconductor, such as diamond or germanium; asuitable compound semiconductor, such as silicon carbide, indiumarsenide, or indium phosphide; or a suitable alloy semiconductor, suchas silicon germanium carbide, gallium arsenic phosphide, or galliumindium phosphide. The semiconductor wafer 152 may further includevarious doped regions, fin features, gate electrodes, dielectricfeatures, and multilevel interconnects.

In the present embodiment, the semiconductor wafer 152 is manufacturedby the fab 150 using a variety of processes including a mandrel-cutpatterning process 154. For example, the process 154 forms a layer ofmaterial on the wafer 152, and performs a photolithography process tothe layer to form mandrel patterns. The photolithography process usesthe mask 146 with the mandrel patterns 306 and 307 for example. Themandrel patterns may be local interconnect lines in an embodiment. Then,the process 154 performs a photolithography process using the mask 146with the modified cut patterns A to produce a first set of etch maskingelements; and etches the mandrel patterns through the first set of etchmasking elements. Then, the process 154 performs anotherphotolithography process using the mask 146 with the modified cutpatterns B to produce a second set of etch masking elements; and etchesthe mandrel patterns through the second set of etch masking elements. Inthis manner, the modified cut patterns A and B collectively cut themandrel patterns. Due to the enhancement to the cut patterns A and B bythe data preparation 132, the process window for the photolithographprocesses is enlarged. In another embodiment, the process 154 mayperform a photolithography process using the mask 146 with the modifiedcut patterns A to produce a first set of etch masking elements; performanother photolithography process using the mask 146 with the modifiedcut patterns B to produce a second set of etch masking elements mergedwith the first set of etch masking elements; and etch the mandrelpatterns through the first and second sets of etch masking elements.Various other embodiments of using the masks 146 can alternatively oradditionally be implemented by the fab 150.

FIG. 9 is a more detailed block diagram of the mask house 130 shown inFIG. 1 according to various aspects of the present disclosure. In theillustrated embodiment, the mask house 130 includes a mask design system(or a mask house tool) 170 that is operable to perform the functionalitydescribed in association with mask data preparation 132 of FIG. 1. Themask design system 170 is an information handling system such as acomputer, server, workstation, or other suitable device. The system 170includes a processor 172 that is communicatively coupled to a systemmemory 174, a mass storage device 176, and a communication module 178.The system memory 174 provides the processor 172 with non-transitory,computer-readable storage to facilitate execution of computerinstructions by the processor. Examples of system memory may includerandom access memory (RAM) devices such as dynamic RAM (DRAM),synchronous DRAM (SDRAM), solid state memory devices, and/or a varietyof other memory devices known in the art. Computer programs,instructions, and data are stored on the mass storage device 176.Examples of mass storage devices may include hard discs, optical disks,magneto-optical discs, solid-state storage devices, and/or a varietyother mass storage devices known in the art. The communication module178 is operable to communicate information such as IC design layoutfiles with the other components in the IC manufacturing system 100, suchas the design house 120. Examples of communication modules may includeEthernet cards, 802.11 WiFi devices, cellular data radios, and/or othersuitable devices known in the art.

In operation, the mask design system 170 is configured to manipulate theIC layout 122, including generating mandrel patterns and cut patterns,and/or modifying cut patterns to enhance process window for mask andwafer fabrication. For example, in an embodiment, mandrel-cut patternpreparation 138 may be implemented as software instructions executing onthe mask design system 170. In such an embodiment, the mask designsystem 170 receives a first GDSII file 124 containing the IC layout 122(or various embodiments 300, 400, 500, and 700) from the design house120. Then, the mask design system 170 modifies the layout using varioustechniques discussed above with respect to mandrel-cut patternpreparation 138. After the layout is modified to enhancemanufacturability thereof, the mask design system 170 transmits to themask fabrication 144 a second GDSII file 142 containing a design layouthaving the mandrel patterns and the modified cut patterns. Inalternative embodiments, the IC layout 122 may be transmitted betweenthe components in IC manufacturing system 100 in alternate file formatssuch as DFII, CIF, OASIS, or any other suitable file type. Further, themask design system 170 and the mask house 130 may include additionaland/or different components in alternative embodiments. By implementingprocesses related to cut pattern modification according to the presentdisclosure, the mask design system 170 is able to produce layouts withhigher quality for mask and/or wafer fabrication.

Referring now to FIG. 10, illustrated therein is a flow chart of amethod 1000 for manufacturing an IC device using mandrel-cut doublepatterning technique, according to various aspects of the presentdisclosure. The method 1000 may be implemented, in whole or in part, bythe system 100 (FIG. 1). It is understood that additional operations canbe provided before, during, and after the method 1000, and someoperations described can be replaced, eliminated, or moved around foradditional embodiments of the method. The method 1000 is an example, andis not intended to limit the present disclosure beyond what isexplicitly recited in the claims. The method 1000 includes operations1002, 1004, 1006, and 1008. Many aspects of these operations have beendiscussed above with respect to FIGS. 1-9. For the purposes ofsimplicity, these operations are briefly discussed below.

At operation 1002, the method 1000 receives a target IC design layouthaving a mandrel layer and two or more cut layers. For example, thetarget IC design layout may be the layout 300, 400, 500, or 700, asdiscussed above or other suitable layouts.

At operation 1004, the method 1000 modifies cut patterns in the two ormore cut layers to improve the manufacturability of these layers formask and/or wafer fabrication. In an embodiment, the operation 1004includes replacing the cut patterns with cut blocks (or modified cutpatterns), shifting the cut blocks to avoid cutting via features, andeliminating extraneous cut blocks. This and other embodiments have beendiscussed with respect to FIGS. 3A-3E and 4A-4D. In another embodiment,the operation 1004 includes identifying critical spacing, identifyingremovable portions of the cut patterns, and removing certain removableportions of the cut patterns. This and other embodiments have beendiscussed with respect to FIGS. 5A-5B and 7A-7C.

At operation 1006, the method 1000 creates masks based on the modifiedIC layout. Particularly, the operation 1006 creates separate masks forthe mandrel patterns and the modified cut patterns in the presentembodiment.

At operation 1008, the method 1000 performs photolithography processeswith the masks in manufacturing one or more wafers.

Although not intended to be limiting, one or more embodiments of thepresent disclosure provide many benefits to IC design and manufacturing.For example, embodiments of the preset disclosure provide efficient andeffective methods for designing or modifying cut patterns for an IClayout. In some embodiments, the resultant cut patterns have enlargedspacing between adjacent ends of the cut patterns. The enlarged spacingimproves the manufacturability of the layout during mask and/or waferfabrication. In some embodiments, the resultant cut patterns havesmaller geometric sizes which remain substantially unchanged duringmanufacturing processes. This also improves the manufacturability of thelayout during mask and/or wafer fabrication.

In one exemplary aspect, the present disclosure is directed to a methodfor integrated circuit (IC) manufacturing. The method includes receivinga layout of the IC having a first region interposed between two secondregions, the first and second regions oriented lengthwise along a firstdirection. The layout includes a first layer having first featuresoriented lengthwise along a second direction perpendicular to the firstdirection, the first features traversing the first region and extendinginto both the second regions. The layout further includes a second layerhaving second features in the first region, the second features orientedlengthwise along the first direction. The layout further includes athird layer having third features in the first region, the thirdfeatures oriented lengthwise along the first direction. The second andthird features collectively form cut patterns for the first features.The method further includes modifying the second and third features by amask house tool, resulting in modified second features and modifiedthird features, wherein the modified second and third featurescollectively form modified cut patterns for the first features. Themodifying of the second and third features meets at least one offollowing conditions for improving mask and wafer manufacturability ofthe layout: (1) total spacing between adjacent modified second featuresis greater than total spacing between adjacent second features, (2)total length of the modified second features is smaller than totallength of the second features, (3) total spacing between adjacentmodified third features is greater than total spacing between adjacentthird features, and (4) total length of the modified third features issmaller than total length of the third features.

In another exemplary aspect, the present disclosure is directed to amethod for integrated circuit (IC) manufacturing. The method includesreceiving a layout of the IC having a first region interposed betweentwo second regions, the first and second regions oriented lengthwisealong a first direction. The layout includes a first layer having firstfeatures oriented lengthwise along a second direction perpendicular tothe first direction, the first features traversing the first region andintersecting the second regions. The layout further includes a secondlayer having second features in the first region, the second featuresoriented lengthwise along the first direction. The layout furtherincludes a third layer having third features in the first region, thethird features oriented lengthwise along the first direction. The secondand third features collectively form cut patterns for the firstfeatures. The method further includes modifying the second and thirdfeatures by a mask house tool for improving mask and wafermanufacturability of the layout, resulting in modified second featuresand modified third features, wherein the modified second and thirdfeatures collectively form modified cut patterns for the first features.The modifying of the second and third features includes: replacing thesecond and third features with blocks in the first region on the secondand third layers respectively, wherein each of the blocks cuts only oneof the first features, wherein the blocks in the second and third layersare arranged alternately over the first features, and wherein the blocksare the modified second and third features and at least one of followingconditions is met: total length of the modified second features issmaller than total length of the second features, and total length ofthe modified third features is smaller than total length of the thirdfeatures.

In yet another exemplary aspect, the present disclosure is directed to amethod for integrated circuit (IC) manufacturing. The method includesreceiving a layout of the IC having a first region interposed betweentwo second regions, the first and second regions oriented lengthwisealong a first direction. The layout includes a first layer having firstfeatures oriented lengthwise along a second direction perpendicular tothe first direction, the first features traversing the first region andthe second regions. The layout further includes a second layer havingsecond features in the first region, the second features orientedlengthwise along the first direction. The layout further includes athird layer having third features in the first region, the thirdfeatures oriented lengthwise along the first direction. The second andthird features collectively form cut patterns for the first features.The method further includes modifying the second and third features by acomputerized mask house tool for improving mask and wafermanufacturability of the layout, resulting in modified second featuresand modified third features, wherein the modified second and thirdfeatures collectively form modified cut patterns for the first features.The modifying of the second and third features meets at least one offollowing conditions: total spacing between adjacent modified secondfeatures is greater than total spacing between adjacent second features,and total spacing between adjacent modified third features is greaterthan total spacing between adjacent third features. The modifying of thesecond and third features includes: on condition that one of the firstfeatures is overlapped by one of the second features and one of thethird features, reducing length of the one of the second features or theone of the third features such that it does not overlap the one of thefirst features.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing an integrated circuit(IC), comprising: receiving a layout of the IC having a first regioninterposed between two second regions, the first and second regionsoriented lengthwise along a first direction, wherein the layout includesa first layer having first features oriented lengthwise along a seconddirection perpendicular to the first direction, the first featurestraversing the first region, wherein the layout further includes asecond layer having second features in the first region, the secondfeatures oriented lengthwise along the first direction, wherein thelayout further includes a third layer having third features in the firstregion, the third features oriented lengthwise along the firstdirection, wherein the second and third features collectively form cutpatterns for the first features; modifying the second and third featuresto form modified cut patterns for the first features, wherein themodifying of the second and third features meets one or more conditionsfor improving mask and wafer manufacturability; and manufacturing the ICusing at least one mask fabricated with one of the first, second, andthird layers.
 2. The method of claim 1, wherein the one or moreconditions for improving mask and wafer manufacturability comprise: (1)total spacing between adjacent modified second features is greater thantotal spacing between adjacent second features, (2) total length of themodified second features is smaller than total length of the secondfeatures, (3) total spacing between adjacent modified third features isgreater than total spacing between adjacent third features, and (4)total length of the modified third features is smaller than total lengthof the third features.
 3. The method of claim 1, wherein the modifyingof the second and third features includes: replacing the second andthird features with blocks in the first region on the second and thirdlayers respectively, wherein each of the blocks cuts only one of thefirst features, wherein blocks in the second and third layers arearranged alternately over the first features, and wherein the blocks arethe modified second and third features.
 4. The method of claim 3,wherein the layout further includes via features overlapping the firstfeatures in the first region, further comprising: checking if any of theblocks overlap the via features; and on condition that one of the blocksoverlaps one of the via features, shifting the one of the blocks alongthe second direction such that it does not overlap the one of the viafeatures while it remains in the first region.
 5. The method of claim 1,wherein the layout further includes a fourth layer having fourthfeatures in the first region and oriented lengthwise along the firstdirection, wherein the second, third, and fourth features collectivelyform cut patterns for the first features, further comprising: modifyingthe fourth features, resulting in modified fourth features, wherein themodified second, third, and fourth features collectively form modifiedcut patterns for the first features, wherein the modifying of the fourthfeatures and the modifying of the second and third features comprises:replacing the second, third, and fourth features with blocks in thefirst region on the second, third, and fourth layers respectively,wherein each of the blocks cuts only one of the first features, whereinthe blocks in the second, third, and fourth layers are arrangedalternately over the first features, and wherein the blocks are themodified second, third, and fourth features.
 6. The method of claim 5,wherein the layout further includes via features overlapping the firstfeatures in the first region, further comprising: on condition that oneof the blocks overlaps one of the via features, shifting the one of theblocks along the second direction such that it does not overlap the oneof the via features while it remains in the first region.
 7. The methodof claim 1, wherein the modifying of the second and third featuresincludes: on condition that one of the first features is overlapped byone of the second features and one of the third features, reducinglength of the one of the second features or the one of the thirdfeatures such that it does not overlap the one of the first features. 8.The method of claim 1, wherein the first layer further has a fourthfeature oriented lengthwise along the second direction, the fourthfeature having an end in the first region and extending into one of thetwo second regions, wherein the modifying of the second and thirdfeatures includes: on condition that the end of the fourth feature isoverlapped by one of the second features and one of the third features,wherein the one of the second features provides a larger margin ofcutting the end of the fourth feature than the one of the thirdfeatures, reducing length of the one of the third features such that itdoes not overlap the fourth feature.
 9. The method of claim 1, whereinthe first layer further has a fourth feature oriented lengthwise alongthe second direction, the fourth feature having an end in the firstregion and extending into one of the two second regions, wherein themodifying of the second and third features includes: on condition thatone of the second features overlaps the end of the fourth feature whileone of the third features overlaps the fourth feature but does notoverlap the end of the fourth feature, reducing length of the one of thethird features such that it does not overlap the fourth feature.
 10. Themethod of claim 1, further comprising: manufacturing a first mask withthe first layer; manufacturing a second mask with the second layerhaving the modified second features; and manufacturing a third mask withthe third layer having the modified third features.
 11. The method ofclaim 10, further comprising: performing a first patterning process to asubstrate with the first mask, thereby forming one or more features onthe substrate; performing a second patterning process to the substratewith the second mask, thereby removing a first portion of the one ormore features; and performing a third patterning process to thesubstrate with the third mask, thereby removing a second portion of theone or more features.
 12. A method for manufacturing an integratedcircuit (IC), comprising: receiving a layout of the IC having a firstregion interposed between two second regions, the first and secondregions oriented lengthwise along a first direction, wherein the layoutincludes a first layer having first features oriented lengthwise along asecond direction perpendicular to the first direction, the firstfeatures traversing the first region and intersecting the secondregions, wherein the layout further includes a second layer havingsecond features in the first region, the second features orientedlengthwise along the first direction, wherein the layout furtherincludes a third layer having third features in the first region, thethird features oriented lengthwise along the first direction, whereinthe second and third features collectively form cut patterns for thefirst features; modifying the second and third features by a mask housetool, wherein the modifying of the second and third features includes:replacing the second and third features with blocks in the first regionon the second and third layers respectively, wherein each of the blockscuts only one of the first features, wherein the blocks in the secondand third layers are arranged alternately over the first features; andmanufacturing the IC using at least one mask fabricated with one of thefirst, second, and third layers.
 13. The method of claim 12, wherein thefirst features are distributed along the first direction with a firstpitch, and each of the blocks has a length along the first directionthat equals to the first pitch.
 14. The method of claim 12, wherein thelayout further includes via features overlapping the first features inthe first region, further comprising: checking if any of the blocksoverlap the via features; and on condition that one of the blocksoverlaps one of the via features, shifting the one of the blocks alongthe second direction such that it does not overlap the one of the viafeatures while it remains in the first region.
 15. The method of claim14, wherein the via features include a source/drain contact or a gatecontact.
 16. The method of claim 12, wherein the blocks on the secondand third layers are arranged generally along two parallel lines.
 17. Amethod for manufacturing an integrated circuit (IC), comprising:receiving a layout of the IC having a first region interposed betweentwo second regions, the first and second regions oriented lengthwisealong a first direction, wherein the layout includes a first layerhaving first features oriented lengthwise along a second directionperpendicular to the first direction, the first features traversing thefirst region and the second regions, wherein the layout further includesa second layer having second features in the first region, the secondfeatures oriented lengthwise along the first direction, wherein thelayout further includes a third layer having third features in the firstregion, the third features oriented lengthwise along the firstdirection, wherein the second and third features collectively form cutpatterns for the first features; modifying the second and third featuresby a computerized mask house tool for improving mask and wafermanufacturability of the layout, resulting in modified second featuresand modified third features, wherein the modified second and thirdfeatures collectively form modified cut patterns for the first features;and manufacturing the IC using at least one mask fabricated with one ofthe first, second, and third layers.
 18. The method of claim 17, whereinthe first layer further has a fourth feature oriented lengthwise alongthe second direction, the fourth feature having an end in the firstregion and extending into one of the second regions, wherein themodifying of the second and third features includes: on condition thatthe end of the fourth feature is overlapped by one of the secondfeatures and one of the third features, wherein the one of the secondfeatures provides a larger margin of cutting the end of the fourthfeature than the one of the third features, reducing length of the oneof the third features such that it does not overlap the fourth feature.19. The method of claim 17, wherein the first layer further has a fourthfeature oriented lengthwise along the second direction, the fourthfeature having an end in the first region and extending into one of thesecond regions, wherein the modifying of the second and third featuresincludes: on condition that one of the second features overlaps the endof the fourth feature while one of the third features overlaps thefourth feature but does not overlap the end of the fourth feature,reducing length of the one of the third features such that it does notoverlap the fourth feature.
 20. The method of claim 17, wherein thelayout further includes via features overlapping the first features inthe first region, the second and third features do not overlap the viafeatures, and the modified second and third features do not overlap thevia features.